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NXP Semiconductors
Prestige English Southeast Asia

Package Roadmap Tool Intern – Package Innovation

Kuala Lumpur, Malaysia
2026-09-14

Role Description

**Role Summary** Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms. **Key Responsibilities** * Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment * Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework * Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations) * Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness * Collaborate cross-functionally with platform, API, and manufacturing teams **Additional Exposure** * Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows **Qualifications** * Degree candidate in Computer Science (preferred), Engineering, or related field * Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks) * Experience with Excel, Power BI, or similar tools for visualization and tool development * Ability to translate technical inputs into structured, scalable frameworks * Self-driven with strong collaboration and communication skills More information about NXP in Malaysia...

Package Roadmap Tool Intern – Package Innovation

NXP Semiconductors

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